page <1> specifcations: applications : all high-density boards product features : small surface mountable, solid state, faster time to trip than standard smd devices, lower resistance than standard smd devices temperature range : -40c to +85c electrical characteristics (23c) i h = hold current-maximum current at which the device will not trip at 23c still air i t = trip current-minimum current at which the device will always trip at 23c still air v max = maximum voltage device can withstand without damage at its rated current (i maximum) i max = maximum fault current device can withstand without damage at rated voltage (v maximum) pd = typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23c still air environment r min = minimum device resistance at 23c prior to tripping r1 max = maximum device resistance at 23c measured 1 hour after tripping or refow soldering of 260c for 20 seconds termination pad characteristics termination pad materials : pure tin hold current trip current rated voltage max. current typical power max. time to trip resistance part number current time r min. r1 max. i h , a l t , a v max., v dc i max., a pd, w amp sec ohms ohms 0.2 0.4 30 10 0.4 8 0.1 0.6 2.5 mc36207 0.35 0.75 16 40 0.3 1.2 mc36211 0.75 1.5 6 100 0.6 0.2 0.09 0.29 mc36216 1 1.8 0.3 0.055 0.21 mc36221 1.1 2.2 0.8 0.04 0.18 mc36222 1.50 3 1 0.03 0.12 mc36229 fsmd product dimensions mc36207 mc36211 mc36216 mc36221 mc36222 mc36229 v1.0 11/10/12 resettable fuse www.element14.com www.farnell.com www.newark.com
page <2> thermal derating curve typical time-to-trip at 23c b=mc36207 c=mc36211 e=mc36216 f=mc36221 g=mc36222 h=mc36229 dimensions : millimetres a b c d e part number min. max. min. max. min. max. min. max. min. max. 3 3.5 1.5 1.8 0.45 0.75 0.1 0.75 - - mc36207 mc36211 1.25 0.25 0.1 0.45 mc36216 1 mc36221 mc36222 0.8 1.4 mc36229 v1.0 11/10/12 resettable fuse www.element14.com www.farnell.com www.newark.com
page <3> dimensions : millimetres material specifcation terminal pad material : pure tin soldering characteristics : meets eia specifcation rs 186-9e, ansi/j-std-002 category 3 pad layouts, solder refow and rework recommendations the dimension in the table below provide the recommended pad layout for each fsmd1812 device device a nominal b nominal c nominal all 1206 series 2 1 1.9 profle feature pb-free assembly average ramp-up rate (tsmax to tp) 3c/second maximum preheat : temperature minimum (tsmin) temperature maximum (tsmax) time (tsmin to tsmax) 150c 200c 60-180 seconds time maintained above: temperature(tl) time (tl) 217c 60-150 seconds peak/classifcation temperature(tp) 260c time within 5c of actual peak temperature (tp) 20-40 seconds ramp-down rate : 6c/second maximum time 25c to peak temperature : 8 minutes maximum note 1: all temperatures refer to of the package, measured on the package body surface solder refow: due to lead free nature, temperature and dwelling time for the soldering damage to other components. 1. recommended max past thickness > 0.25mm. 2. devices can be cleaned using standard methods and aqueous solvent. 3. rework use standard industry practices. 4. storage environment : < 30c / 60% rh caution: 1. if refow temperatures exceed the recommended profle, devices may not meet the performance requirements. 2. devices are not designed to be wave soldered to the bottom side of the board. v1.0 11/10/12 resettable fuse www.element14.com www.farnell.com www.newark.com
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